Tessolve and NXP Semiconductors have partnered to enhance a mass-market digital connected cluster reference design.
This collaboration offers Original Equipment Manufacturers (OEMs) an advanced solution for integrating digital cluster systems into vehicles with minimal customisation needs, thereby reducing complexity, costs, and time-to-market.
The solution is automotive compliant, production-ready, and optimised for deployment, a statement added.
“High-resolution digital displays play a pivotal role in ensuring the safe operation of electric vehicles (EVs) with limited range. They furnish drivers with indispensable information, including battery status updates, navigation guidance, and the whereabouts of nearby charging stations,” said Dan Loop, Vice President and General Manager, Automotive Edge Product Lines, NXP. “The NXP solution delivers advanced graphics along with smartphone connectivity to enable a rich user experience in a very cost-effective system solution. The production ready DCC platform now makes it that much easier for customers to get their products to market quickly.”
“Our NXP i.MX RT1170-based cluster with advanced performance graphics and rich wireless and audio connectivity delivers a digital driving experience which takes us into the future of two-wheeler mobility. Built using Tessolve’s 3-D product engineering principle, which stands for, Development platform, Deployable system, or Derivative solution, our cluster can be adopted by OEMs either “as is” or can be customized for their needs. Tessolve accelerates OEMs’ time to market with exceptional ODM abilities, offering digital cluster white labelling as well”, said Kiran Kumar Nagendra, AVP- Embedded Systems, Tessolve.
Tessolve is a System productisation and Silicon Engineering solution provider, operating in 10 countries across US, Europe, and APAC regions with inhouse infrastructure and world-class lab facilities with a global Engineering strength of 3000 Engineers.
